New 10-core SoC Helio X30 details revealed: using TSMC’s 10nm FinFE process

New 10-core SoC Helio X30 details revealed: using TSMC’s 10nm FinFE process

At MTK’s spring launch, the company officially brought us the 10-core processor Helio X20, as well as Helio X25. And it was confirmed that their newest chip Helio X25/20 would be equipped on the upcoming flagship smartphones like LeEco Le 2, Meizu Pro 6 and so on. Of course, their 10-core chip plan doesn’t stop here. The company seems to have more plans on releasing Deca-core processor. Yesterday afternoon, MTK’s new generation Deca-core processor was exposed online with details, revealing that the chip would use TSMC’s  10nm FinFET process.

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According to the exposure, Helio X30 still uses Tru-Cluster A72+A53 architecture, 2* 2.8GHz A57 cores+4* 2.2 GHz A53 cores+4* 2GHz A53 cores. Its frequency is higher than the Helio X20 with 28nm process, CPU performance is 20% improved, while pwoer-consumption is half decreased.

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Besides, Helio X30 supports dual camera and offers 26MP resolution, has Full Netcom base band and also supports LTE Cat.13. Meanwhile, it improves the performance on VR. However, Helio X30 would go back to use Imagination PowerVR GPU, and it is custom version PowerVR 7XT series, still 4-core.

Reportedly, Helio X30 would the first 10nm chip to be put in mass production, estimated to be taped-out in June and start mass production at the end of the year. So Helio X30 will probabaly hit the market in early 2017. Are you looking forward to the Helio X30-powered flagship?

mling

Lover of tech devices and mobiles supporter for a long time.

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Lover of tech devices and mobiles supporter for a long time.

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