Letv Le2 released today: With bezel-less 3.0/ ultrasonic fingerprint/Fast charging 3.0/Helio X20 chip

Letv Le2 released today: With bezel-less 3.0/ ultrasonic fingerprint/Fast charging 3.0/Helio X20 chip

After a series of leaks, today Letv will officially hold the new product release conference at 14:00pm in Beijing Wukesong Sports Center, Letv Superphone2 will be officially released. According to the previous rumors, Letv Le2 will use some new design elements, while it is also equipped with top-level configuration and functions. The details are as follows:

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  1. Bezel-less 3.0

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In the first generation of Letv Superphone, Letv puts forward the concept of “ID bezel-less”, today Letv Superphone will bring “Borderless 3.0”, the screen proportion even exceeded iPhone.

  1. Cancel 3.5mm headphone jack

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In these few days, there was rumored that Letv LeEco Le2 will cancel the 3.5mm headphone jack. Some analysts also said, if getting rid of the 3.5mm headphone jack, the phone may become thinner and more compact, so Letv Superphone2 will be worth expecting.

  1. Ultrasonic fingerprint recognition

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As early as Letv Le Max Pro released, Letv has claimed that it will support ultrasonic fingerprint recognition, and this feature did not be applied on Samsung S5 and Xiaomi Mi5. As can be seen from the propaganda poster, Letv Le2 is very likely to support ultrasonic fingerprint recognition, which will have a big leading advantage.

  1. Fast Charging3.0

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In recent years, more and more manufacturers focus on smartphone charging aspect, fast charging become a new hot topic. Previously, there are Letv fast charging charger spy photos leaked on the internet, and revealed that Letv new phone will support 3.6-8V/3A, 12V/2A fast charging, maximum joint power is 24W.

  1. Helio X20 10-core chip

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In March, Mediatek held a press conference, and officially released its Helio X20 chip, during the meeting, Letc CEO Feng Xing confirmed that Letv Superphone2 will be equipped with Helio X20 processor.

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