One Plus 3T Tear Down Processing Shows True Flagship
One Plus 3T is the newest flagship under One Plus, it loads Snapdragon 821 processor operating 6GB memory, which the whole performance is very formidable, what’s more, the Antutu running points over than 160 thousand. As a flagship phone , so what workmanship does it has, today, let’s have a look on it.
One Plus 3T used three-stage in full metal design, the screen part connected with back cover via buckle and screw to fix, before removing, the first thing we need to do is to twist off the screws at the bottom.
After switching off the screws, be carefully using the sucker to separate the screen part from the metal back cover.
When opening the back cover, as we can see that vast majority of components are set on the screen. But there is not too much components on the the back, in which including vibration motor, NFC coil, three-stage side keys. It is worthy of mentioning that, the back cover also covered with thermal conductivity cotton, ensuring with a good heating performance while fixing the components.
These are motherboard and the upper of the back
These are bottom small circuit board part and back cover bottom
First, disassemble the small circuit board at the bottom, just need to twist off the screws.
On small circuit board there is a fixed cable can not be removed, and 3.5 mm earphone jack and loudspeaker components are also included. The purpose of doing this is to prevent each part appearing connection phenomenon.
Small circuit board: From left to right respectively 3.5mm earphone jack, Type-C port, and loudspeaker.
Fingerprint module: undo the bottom small circuit board that the fingerprint module can be seen, which is unable to press, just need to touch slightly.
Before dismantling the motherboard, the first step is to be carefully remove the crews because of there are small buckle fixed on it.
Motherboard: general speaking, the shield is used to protect the chip on motherboard, but the shield can not be undo will affect chip heating to a certain extent.
However, One Plus 3T took fixed frame and removable shield mode to perfectly defend the issue between the chip and heating.In addition, the shield covered with thermal grease to in further improve heating performance.
Taking down the shield that you can see all the chips. Red area is 128GB UFS 2.0 flash chip, the green area is audio amplifier chip, the blue area is Qualcomm WTR3925 RF chip, and the yellow area is Qualcomm QCA6164A wireless control chip.
The above picture is the other side of motherboard. The red part is Samsung 6GB LPDDR4 memory and Snapdragon 821 processor, which the memory and CPU are packed together. The green part are two Qualcomm PM8996 power management chips, the blue part is RF chip.
On the motherboard, besides the shield can be removed, there are also including these two cameras. As you can see that the left side is SONY IMX 298 16MP main camera, and the right side is 16MP front facing camera.
One Plus 3T with a 3400mAh battery capacity.
The disassembling processing show One Plus 3T has been made an affect on workmanship.
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